INFINITE POWDER CU 01 uses a patent-pending post-treatment of copper powder. This process, specially developed for additive manufacturing, makes a problem-free 3D printing of copper with all common standard infrared lasers possible in the first place.

Applications

• Selective laser sintering (SLM)
• Laser application welding (LMD)
• Plasma Metallization / Digital Direct Metallization (DDM)

Electrical and thermal conductivity

Electrical conductivity: > 90% ( > 52 MS/m)
Thermal conductivity: > 90% ( > 360 W/(m-K)

Properties

• Conductivity: > 90% IACS ( > 52 MS)
• Thermal conductivity. >90% IACS ( > 360 MS)
• Tensile strength: > 220 MPa
• Yield limit R_{p 0.2}: > 110 MPa
• Elongation at break: 24%
• ideally suited on all commonly used
  SLM systems (e.B. EOS M 290)

Product Information

• Pure copper: > 99.5%
• Particle size: 10 – 45 microns
• Particle size (D_50):30 microns
• Volume build-up rate: 2.2 mm3/s
• Layer construction thickness: 30 microns
• Porosity: < 0.1%
• TRL Level 3
• Area angle: > 41°